发明名称 ELECTRIC CIRCUIT AND METHOD OF MANUFACTURE
摘要 In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure.
申请公布号 US2016105964(A1) 申请公布日期 2016.04.14
申请号 US201414511157 申请日期 2014.10.09
申请人 Semiconductor Components Industries, LLC 发明人 Inoguchi Hiroshi;Taguchi Takayuki
分类号 H05K1/18;H05K3/00;H05K3/34 主分类号 H05K1/18
代理机构 代理人
主权项 1. A method for manufacturing an electric circuit, comprising: providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor; increasing a distance between the first sidewall of the first conductor and the second sidewall of the second conductor; coupling a first circuit element to the first conductor; and encapsulating the first circuit element and a portion of the first conductor having the first sidewall in a mold compound.
地址 Phoenix AZ US