发明名称 |
ELECTRIC CIRCUIT AND METHOD OF MANUFACTURE |
摘要 |
In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure. |
申请公布号 |
US2016105964(A1) |
申请公布日期 |
2016.04.14 |
申请号 |
US201414511157 |
申请日期 |
2014.10.09 |
申请人 |
Semiconductor Components Industries, LLC |
发明人 |
Inoguchi Hiroshi;Taguchi Takayuki |
分类号 |
H05K1/18;H05K3/00;H05K3/34 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for manufacturing an electric circuit, comprising:
providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor; increasing a distance between the first sidewall of the first conductor and the second sidewall of the second conductor; coupling a first circuit element to the first conductor; and encapsulating the first circuit element and a portion of the first conductor having the first sidewall in a mold compound. |
地址 |
Phoenix AZ US |