| 摘要 |
An adapter for LED modules of the package/array type, comprising an adapter body that is provided with a cavity adapted to accommodate an LED module of the package/array type and is associable with a heat sink; a heat dissipation interface element can be inserted between the LED module and the heat sink; the adapter comprising elements for retaining the LED module, which are adapted to engage the face of the LED module that is directed toward the heat sink, in order to retain the LED module within the cavity. |
