| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure which allows for enhancement of uniformity of the amount of solder, at a plurality of solder parts in a connection connecting between electrodes electrically.SOLUTION: A method of manufacturing a connection structure includes a step for arranging a conductive paste on the surface of a first connection object member, a step for arranging a second connection object member on the surface of the conductive paste so that a first electrode and a second electrode face each other, and a step for connecting the first and second electrodes electrically by the solder part in the connection, by heating the conductive paste above the melting point of solder particles and above the setting temperature of a thermosetting component. The conductive paste contains a plurality of fillers, together with the thermosetting component and the plurality of solder particles.SELECTED DRAWING: Figure 1 |
