LED PACKAGE

摘要

The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.

主权项

1. A light emitting diode (LED) die comprising:
a substrate; an N type semiconductor layer formed on the substrate; an active layer formed on the N type semiconductor layer; a P type semiconductor layer formed on the substrate; at least one recess penetrating through the P type semiconductor layer and the active layer and extending to the N type semiconductor layer; an insulating layer covering the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covering a top of the P type semiconductor layer except an opening on the P semiconductor layer; and a pair of electrodes, one of the pair of electrodes filling the recess and being electrically connected to the N type semiconductor layer, and the other one of the pair of electrodes connected to the P type semiconductor layer in the opening.