SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING

摘要

A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved.

主权项

1. A semiconductor package, comprising:
a package substrate comprising:
a dielectric layer;a first circuit layer disposed on or in the dielectric layer; anda plurality of pillars disposed on the first circuit layer, wherein each of the pillars has a recess portion in the top end of the pillar; a die; and a plurality of solder balls disposed on the die, wherein each of the solder balls is bonded to each of the pillars and kept at the recess portion.