发明名称 JOINING STRUCTURE AND ITS MANUFACTURING METHOD, AND COOLER
摘要 PROBLEM TO BE SOLVED: To provide a joining structure which suppresses a malfunction caused by the generation and growth of spatters or burrs which are generated at joining without complicating or enlarging a device for joining joined members, and a cooler including the joining structure.SOLUTION: A joining structure comprises a first joined member 1 having a first main surface 1s, and a second joined member 2 having a second main surface 2s. The first joined member 1 and the second joined member 2 are connected to each other in a joining part 3. At least either of the first or second joined members 1, 2 includes a thin-thick part 5 in the joining part 3. A thickness with respect to a direction which intersects with the main surfaces 1s, 2s in the thin-thickness part 5 is thinner than a thickness of a heavy-thickness part other than the thin-thickness part 5.SELECTED DRAWING: Figure 4
申请公布号 JP2016052666(A) 申请公布日期 2016.04.14
申请号 JP20140178899 申请日期 2014.09.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 IKEDA TAKUYA;MONOTANE TAKESHI;ISHII RYUICHI;TOCHIYAMA SHIGENOBU
分类号 B23K20/12;B23K1/00;B23K9/00;B23K11/00;B23K11/36;B23K15/00;B23K26/21 主分类号 B23K20/12
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