METHOD FOR PRODUCING THROUGH-HOLES IN A WALL OF A COMPONENT, BY MEANS OF LASER RADIATION

摘要

The invention relates to a method for producing through-holes (7) in a wall (3) of a component (1), by means of laser radiation, said wall delimiting a cavity (2) in which a protection agent (5) is provided that can be liquefied when heated. According to said method, through-holes (7) are successively produced in the wall (3) of the component (1) in a plurality of defined points, two directly subsequent through-holes (7) being produced such that a through-hole (7) is produced in a predetermined point and the next through-hole (7) is produced in an additional point which is further away from the predetermined point than at least two, in particular three or more omitted points that are closer to the predetermined point, and/or are produced such that a through-hole (7) is produced in a predetermined point and the next through-hole (7) is produced an additional point. At least one point which lies between the predetermined and the additional point is omitted, in particular two or more points which lie between the predetermined point and the additional point are omitted.