| 摘要 |
A free grounding film and a manufacturing method therefor, and a shielding circuit board including the free grounding film and a grounding method. The free grounding film comprises at least one conductor layer (3). The shielding circuit board including the free grounding film is formed in a manner that an electromagnetic wave shielding film is arranged on a printed circuit board, and the upper surface of the electromagnetic wave shielding film is provided with the free grounding film. The grounding method for the shielding circuit board adopts one of three modes. The manufacturing method for the free grounding film comprises the following steps that a) a conductive high-temperature-resistant anti-oxidation layer (2) is formed on the surface of a metal foil (1); b) at least one conductor layer (3) is formed on the other side of the high-temperature-resistant anti-oxidation layer (2); c) an adhesive film layer (4) is formed on the conductor layer (3) or that a) a resin-based high-temperature-resistant anti-oxidation layer (2) is formed on the surface of a polyester carrier film (1); b) at least one conductor layer (3) is formed on the other side of the high-temperature-resistant anti-oxidation layer (2); c) the adhesive film layer (4) is formed on the conductor layer (3). By means of the free grounding film, the conventional shield grounding manner is changed, the product reliability can be greatly improved, and the cost is reduced. |
