发明名称 |
JOINT MATERIAL AND JOINT METHOD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive joint material easily printing on an articles to be jointed and capable of suppressing generation of voids in a joint part of articles to be jointed each other and a joint method using the same.SOLUTION: There is provided a joint material consisting of copper powder having average particle diameter of 0.1 to 1 μm containing 0.3 mass% of carbon and a copper paste containing an alcohol solvent such as monoalcohol, diol and terpene alcohol with the content of the copper powder of 80 to 95 mass% and the content of the alcohol solvent of 5 to 20 mass%.SELECTED DRAWING: None |
申请公布号 |
JP2016053216(A) |
申请公布日期 |
2016.04.14 |
申请号 |
JP20150168573 |
申请日期 |
2015.08.28 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
ENDO KEIICHI;MIYOSHI HIROMASA;MOTOMURA KOICHI;KURITA TORU |
分类号 |
B22F7/08;B22F1/00;B23K20/00;C22C9/00 |
主分类号 |
B22F7/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|