发明名称 JOINT MATERIAL AND JOINT METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive joint material easily printing on an articles to be jointed and capable of suppressing generation of voids in a joint part of articles to be jointed each other and a joint method using the same.SOLUTION: There is provided a joint material consisting of copper powder having average particle diameter of 0.1 to 1 μm containing 0.3 mass% of carbon and a copper paste containing an alcohol solvent such as monoalcohol, diol and terpene alcohol with the content of the copper powder of 80 to 95 mass% and the content of the alcohol solvent of 5 to 20 mass%.SELECTED DRAWING: None
申请公布号 JP2016053216(A) 申请公布日期 2016.04.14
申请号 JP20150168573 申请日期 2015.08.28
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 ENDO KEIICHI;MIYOSHI HIROMASA;MOTOMURA KOICHI;KURITA TORU
分类号 B22F7/08;B22F1/00;B23K20/00;C22C9/00 主分类号 B22F7/08
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