| 发明名称 |
SEMICONDUCTOR DEVICE HAVING THROUGH CHIP VIA |
| 摘要 |
A semiconductor device includes a plurality of chips; a first through-chip via vertically passing through the chips, a power-saving unit suitable for being precharged to a precharge voltage during a precharge period; and a driving unit suitable for driving data using the precharge voltage outputted from the power-saving unit, during a driving period. |
| 申请公布号 |
US2016105171(A1) |
申请公布日期 |
2016.04.14 |
| 申请号 |
US201514661890 |
申请日期 |
2015.03.18 |
| 申请人 |
SK hynix Inc. |
发明人 |
KIM Hong-Gyeom |
| 分类号 |
H03K17/687;H01L23/48 |
主分类号 |
H03K17/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a plurality of chips; a first through-chip via vertically passing through the chips; a power-saving unit suitable for being precharged to a precharge voltage during a precharge period; and a driving unit suitable for driving data using the precharged voltage outputted from the power-saving unit, during a driving period. |
| 地址 |
Gyeonggi-do KR |
