发明名称 |
FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) DEVICE AND METHOD OF MANUFACTURING SAME |
摘要 |
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary method includes providing a semiconductor substrate; forming a first fin structure and a second fin structure over the semiconductor substrate; forming a gate structure over a portion of the first and second fin structures, such that the gate structure traverses the first and second fin structures; epitaxially growing a first semiconductor material on exposed portions of the first and second fin structures, such that the exposed portions of the first and second fin structures are merged together; and epitaxially growing a second semiconductor material over the first semiconductor material. |
申请公布号 |
US2016104706(A1) |
申请公布日期 |
2016.04.14 |
申请号 |
US201514885272 |
申请日期 |
2015.10.16 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Xu Jeff J.;Chang Chih-Hao |
分类号 |
H01L27/088;H01L29/165;H01L29/78;H01L29/06 |
主分类号 |
H01L27/088 |
代理机构 |
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代理人 |
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主权项 |
1. A integrated circuit device comprising:
a first fin and a second fin disposed over a semiconductor substrate; an isolation structure disposed between the first and second fins, such that the first and second fins are isolated from each other; a gate structure disposed over a portion of the first and second fins, the gate structure traversing the first and second fins, thereby separating a source region and a drain region of the first and second fins; a first semiconductor layer disposed over another portion of the first and second fins; and a second semiconductor layer disposed over the first semiconductor layer, wherein the source and drain regions of the first and second fins include a portion of the first and second semiconductor layers, wherein the second semiconductor layer is an epitaxial semiconductor layer. |
地址 |
Hsin-Chu TW |