| 发明名称 |
Robust and Reliable Power Semiconductor Package |
| 摘要 |
In one implementation, a semiconductor package includes a patterned conductive carrier including a support segment having a partially etched recess. The semiconductor package also includes an integrated circuit (IC) situated on the support segment, and an electrical connector coupling the IC to the partially etched recess. In addition, the semiconductor package includes a packaging dielectric formed over the patterned conductive carrier and the IC. The packaging dielectric interfaces with and mechanically engages the partially etched recess so as to prevent delamination of the electrical connector. |
| 申请公布号 |
US2016104688(A1) |
申请公布日期 |
2016.04.14 |
| 申请号 |
US201514861186 |
申请日期 |
2015.09.22 |
| 申请人 |
International Rectifier Corporation |
发明人 |
Cho Eung San |
| 分类号 |
H01L23/00;H01L29/66;H01L21/52;H01L21/56;H01L29/778;H01L29/205;H01L23/495;H01L23/31;H01L21/48;H01L29/20;H01L29/16;H01L29/78;H01L27/06 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a patterned conductive carrier including a support segment having a partially etched recess; an integrated circuit (IC) situated on said support segment; an electrical connector coupling said IC to said partially etched recess; a packaging dielectric formed over said patterned conductive carrier and said IC, said packaging dielectric interfacing with and mechanically engaging said partially etched recess so as to prevent delamination of said electrical connector. |
| 地址 |
El Segundo CA US |
