| 摘要 |
A semiconductor device includes a base member and a first semiconductor chip mounted over the base member. The first semiconductor chip including a first circuit, a second circuit, and a third circuit arranged between the first circuit and the second circuit and a plurality of pads. The first, second and third circuits are arranged along a first side of the first semiconductor chip. In plan view, the pads are located outside of the circuits and include a plurality of first pads arranged at a first pitch, and a plurality of second pads arranged at the first pitch. A distance between a first pad group comprised of the first pads and a second pad group comprised of the second pads is larger than the first pitch. Further, in a plan view, a part of the third circuit is located between the first pad group and the second pad group. |
| 主权项 |
1. A semiconductor device, comprising:
a base member; and a first semiconductor chip mounted over the base member, the first semiconductor chip including a plurality of circuits and a plurality of pads, wherein the circuits include a first circuit, a second circuit, and a third circuit, which is arranged between the first circuit and the second circuit, wherein the first, second and third circuits are arranged along a first side of the first semiconductor chip, wherein, in a plan view, the plurality of pads are spaced apart from the first, second and third circuits, wherein the plurality of pads include a plurality of first pads arranged at a first pitch, and a plurality of second pads arranged at the first pitch, wherein in the plan view, the plurality of first pads and the plurality of second pads are arranged along the first side of the first semiconductor chip, wherein a distance between a first pad group comprised of the plurality of first pads and a second pad group comprised of the plurality of second pads is greater than the first pitch, and wherein, in the plan view, a part of the third circuit is located between the first pad group and the second pad group, wherein the first circuit is a digital interface circuit, wherein the second circuit is an analog interface circuit, and wherein the third circuit is a circuit other than the digital interface circuit and the analog interface circuit. |
