发明名称 |
Precise Critical Dimension Control Using Bilayer ALD |
摘要 |
Methods for self-aligned multiple patterning including controlled slimming of features during spacer layer deposition. Multiple spacer layer deposition process conditions produce a balance between controlling the damage to the features and increasing production throughput. |
申请公布号 |
US2016104613(A1) |
申请公布日期 |
2016.04.14 |
申请号 |
US201514878576 |
申请日期 |
2015.10.08 |
申请人 |
Applied Materials, Inc. |
发明人 |
Takeshita Kenji;Sakamoto Nobuhiro;Takenaga Yoshihiro;Xia Li-Qun;Sriram Mandyam |
分类号 |
H01L21/02;H01L21/311;H01L21/027 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A processing method comprising:
providing a substrate having a photoresist with features thereon, each of the features having a top, sidewalls and a width; depositing up to 10 layers of a spacer film using a first process condition to decrease the width of the photoresist features; depositing additional spacer film using a second process condition to form a spacer film having a total thickness less than about 50 nm etching the spacer film from the top of the photoresist features leaving the spacer film on the sidewalls of the features; removing the photoresist to leave the spacer film from the sidewalls of the features and expose portions of the substrate; and etching the exposed portions of the substrate to form adjacent pairs of substrate features. |
地址 |
Santa Clara CA US |