发明名称 RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET
摘要 PROBLEM TO BE SOLVED: To provide a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardancy.SOLUTION: The resin composition comprises an epoxy resin (A), a maleimide compound, a curing agent, and an inorganic filler, the epoxy resin (A) being represented by formula (I).SELECTED DRAWING: None
申请公布号 JP2016053168(A) 申请公布日期 2016.04.14
申请号 JP20150199633 申请日期 2015.10.07
申请人 MITSUBISHI GAS CHEMICAL CO INC 发明人 KOGASHIWA TAKAAKI;TAKAHASHI HIROSHI;MIYAHIRA TETSURO;UENO MASAYOSHI;KATO SADAHIRO
分类号 C08G59/20;C08G59/32;C08L63/00 主分类号 C08G59/20
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