发明名称 |
COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL, AND METHOD FOR PRODUCING COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL |
摘要 |
A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11≦[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≦19 is satisfied, a relationship of 7≦[Ni]/[P]≦40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t≦0.5 at W bending, solderability is excellent, and a Young's modulus is 100×103 N/mm2 or more. |
申请公布号 |
US2016104550(A1) |
申请公布日期 |
2016.04.14 |
申请号 |
US201514946108 |
申请日期 |
2015.11.19 |
申请人 |
Mitsubishi Shindoh Co., Ltd. ;MITSUBISHI MATERIALS CORPORATION |
发明人 |
Oishi Keiichiro;Hokazono Takashi;Takasaki Michio;Nakasato Yosuke |
分类号 |
H01B1/02;C22F1/08;C22C9/04 |
主分类号 |
H01B1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A copper alloy sheet for terminal and connector materials comprising:
4.5 mass % to 12.0 mass % of Zn; 0.40 mass % to 0.9 mass % of Sn; 0.01 mass % to 0.08 mass % of P; and 0.20 mass % to 0.85 mass % of Ni, with a remainder being Cu and inevitable impurities, wherein a content of Zn [Zn] (mass %), a content of Sn [Sn] (mass %), a content of P [P] (mass %) and a content of Ni [Ni] (mass %) have a relationship of 11≦[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≦19, and the copper alloy sheet is a copper alloy sheet for terminal and connector materials which further has a relationship of 7≦[Ni]/[P]≦40 with regard to a content of Ni and a content of P in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t≦0.5 at W bending, solderability is excellent, and a Young's modulus is 100×103N/mm2 or more. |
地址 |
Tokyo JP |