发明名称 |
HIGH THERMAL CONDUCTIVE RESIN MOLDED BODY AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a high thermal conductive resin molded body excellent in thermal conductivity.SOLUTION: There is provided a high thermal conductive resin molded body containing (A) a polyalkylene terephthalate thermoplastic polyester resin, (B) tabular talc and (C) fibrous reinforcement material and having percentage content of the tabular talc of 10 to 60 vol.% based on 100 vol.% of total volume percentage of all composition and number average particle diameter of the tabular talc of 20 to 80 μm and the tabular talc is aligned in a surface direction.SELECTED DRAWING: None |
申请公布号 |
JP2016053188(A) |
申请公布日期 |
2016.04.14 |
申请号 |
JP20160001290 |
申请日期 |
2016.01.06 |
申请人 |
KANEKA CORP |
发明人 |
UCHIDA SOICHI;MATSUMOTO KAZUAKI;SAKAGUCHI MASASHI;NODA TAIJI;UBUKATA SHOJI |
分类号 |
C08L67/02;B29C45/00;C08K3/22;C08K3/34;C08K3/38;C08K7/02 |
主分类号 |
C08L67/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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