发明名称 HIGH THERMAL CONDUCTIVE RESIN MOLDED BODY AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a high thermal conductive resin molded body excellent in thermal conductivity.SOLUTION: There is provided a high thermal conductive resin molded body containing (A) a polyalkylene terephthalate thermoplastic polyester resin, (B) tabular talc and (C) fibrous reinforcement material and having percentage content of the tabular talc of 10 to 60 vol.% based on 100 vol.% of total volume percentage of all composition and number average particle diameter of the tabular talc of 20 to 80 μm and the tabular talc is aligned in a surface direction.SELECTED DRAWING: None
申请公布号 JP2016053188(A) 申请公布日期 2016.04.14
申请号 JP20160001290 申请日期 2016.01.06
申请人 KANEKA CORP 发明人 UCHIDA SOICHI;MATSUMOTO KAZUAKI;SAKAGUCHI MASASHI;NODA TAIJI;UBUKATA SHOJI
分类号 C08L67/02;B29C45/00;C08K3/22;C08K3/34;C08K3/38;C08K7/02 主分类号 C08L67/02
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