| 摘要 |
PROBLEM TO BE SOLVED: To provide an appropriately packaged piezoelectric oscillator.SOLUTION: An oscillator 1 holds a wiring substrate 7 with an opening 37h which penetrates from the first principal surface 37a to the second principal surface 37b, a vibrator 3 which is mounted on the first principal surface 37a to cover the opening 37h, an integrated circuit element 5 which is placed inside the opening 37h and mounted on the vibrator 3. The wiring substrate 7 holds an insulation substrate 37 with the first principal surface 37a, the second principal surface 37b and the opening 37h, a pad for a vibrator 41 which is installed on the first principal surface 37a and on which a vibrator 3 is mounted, a solder resist 39 which exposes the pad for a vibrator 41 and covers the insulation substrate 37. The inner peripheral surface of the opening 37h holds the first non-arranged region R1 where the solder resist 39 is not arranged.SELECTED DRAWING: Figure 1 |
