| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing sheet which enables the suppression of the creation of voids or the occurrence of segregation of filler when forming a sealed body in which a semiconductor chip is buried in a sealing sheet.SOLUTION: A sealing sheet has a viscosity at 90°C within a range of 1-50000 Pa s.SELECTED DRAWING: Figure 1 |
