MULTI-LAYER SUBSTRATE, ELECTRONIC DEVICE USING MULTI-LAYER SUBSTRATE, MANUFACTURING METHOD FOR MULTILAYER SUBSTRATE, SUBSTRATE, AND ELECTRONIC DEVICE USING SUBSTRATE

摘要

In a multi-layer substrate, a glass cloth of a build-up layer is deformed toward a land below the land. A thickness of a resin layer of the build-up layer from the glass cloth to a surface adjacent to the land is set to be smaller than a dimension from the glass cloth to a front surface of a core layer. With the above configuration, a progress or an enlargement of a crack can be suppressed from a stage in which the crack is smaller. Therefore, the progress and the enlargement of the crack can be delayed. As a result, even if the crack is generated, an insulating property between the land and an inner layer wire is ensured, and the land and the inner layer wire can be restricted from being short-circuited.

主权项

1. A multi-layer substrate comprising:
a core layer having a front surface; an inner layer wire disposed on the front surface of the core layer; a build-up layer arranged on the front surface of the core layer in a state where the build-up layer covers the inner layer wire, the build-up layer including a glass cloth woven with glass fibers into a film shape, and a resin layer that covers both of front and rear surfaces of the glass cloth; and a land disposed on a surface of the build-up layer opposite to the core layer, over which an electronic component is to be mounted through a solder, wherein the glass cloth is extruded toward the land in a portion of the build-up layer, the portion being located between the land and the core layer, and a thickness of the resin layer from the glass cloth to the surface of the resin layer adjacent to the land is smaller than a dimension from the glass cloth to the front surface of the core layer in the portion.