| 摘要 |
Provided is a composition for forming a copper film, which is in the form of a solution that does not contain solid phases such as fine particles, and which is capable of forming a copper film having sufficient conductivity by being applied to a base and heated thereon at a temperature less than 160°C. A composition for forming a copper film, which contains 0.1-3.0 moles/kg of copper formate or a hydrate thereof and 0.01-18.0 moles/kg of 4-aminopiperidine. After applying this composition for forming a copper film onto a base, the base on which the composition for forming a copper film is applied is heated to a temperature of 200°C or less, thereby forming a copper film. |
