GLASS SUBSTRATE MANUFACTURING METHOD FOR INCREASING BONDING FORCE WITH ELECTROLESS PLATING LAYER

摘要

The present invention relates to a glass substrate manufacturing method and, more specifically, to a glass substrate manufacturing method capable of increasing a bonding force with an electroless plating layer to be plated on the surface. To this end, the present invention provides a glass substrate manufacturing method for increasing a bonding force with an electroless plating layer, comprising: a first etching step of immersing a glass substrate into a hydrofluoric acid (HF) solution; and a second etching step of forming a three-dimensional network structure in the inner direction on the surface of the glass substrate on which the electroless plating layer is to be plated, by immersing, into a saturated silica solution, the glass substrate etched through the first etching step.