发明名称 POLYAMIDE RESIN COMPOSITION AND FOAM MOLDED BODY CONTAINING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition capable of providing a foam molded body having high foaming ratio, uniform bubble diameter and excellent in surface appearance with good operability.SOLUTION: There is provided a polyamide resin composition containing 100 pts.mass of (A) a polyamide resin having relative viscosity under a condition of a temperature of 26°C and concentration of 1 g/100 ml in a range of 2.0 to 4.0 and 0.05 to 5 pts.mass of (B) a (meth)acrylic acid ester compound having two or more (meth)acrylic groups or one or more (meth)acrylic group and one or more glycidyl group or vinyl group in a molecule with 96% sulfuric acid as a solvent and having specific distortion hardening coefficient and melting tensile at 240°C of 20 to 200 mN.SELECTED DRAWING: Figure 1
申请公布号 JP2016053139(A) 申请公布日期 2016.04.14
申请号 JP20140180278 申请日期 2014.09.04
申请人 UNITIKA LTD 发明人 ISHII SHIGEAKI;NEGI YUKINARI;USUI AZUSA
分类号 C08F283/04;C08J9/04;C08K5/101;C08K5/14;C08L77/00 主分类号 C08F283/04
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