发明名称 |
POLYAMIDE RESIN COMPOSITION AND FOAM MOLDED BODY CONTAINING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition capable of providing a foam molded body having high foaming ratio, uniform bubble diameter and excellent in surface appearance with good operability.SOLUTION: There is provided a polyamide resin composition containing 100 pts.mass of (A) a polyamide resin having relative viscosity under a condition of a temperature of 26°C and concentration of 1 g/100 ml in a range of 2.0 to 4.0 and 0.05 to 5 pts.mass of (B) a (meth)acrylic acid ester compound having two or more (meth)acrylic groups or one or more (meth)acrylic group and one or more glycidyl group or vinyl group in a molecule with 96% sulfuric acid as a solvent and having specific distortion hardening coefficient and melting tensile at 240°C of 20 to 200 mN.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016053139(A) |
申请公布日期 |
2016.04.14 |
申请号 |
JP20140180278 |
申请日期 |
2014.09.04 |
申请人 |
UNITIKA LTD |
发明人 |
ISHII SHIGEAKI;NEGI YUKINARI;USUI AZUSA |
分类号 |
C08F283/04;C08J9/04;C08K5/101;C08K5/14;C08L77/00 |
主分类号 |
C08F283/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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