| 主权项 |
1. An electronic device comprising:
a substrate having a first substrate face, a second substrate face opposite the first substrate face, and lateral substrate faces between the first substrate face and the second substrate face; an electronics part mounted on the first substrate face; and a mold resin that seals the electronic part and the first substrate face, wherein the second substrate face is exposed from the mold resin, wherein: at least one lateral surface of the substrate is a cut surface that is cut together with the mold resin; the mold resin has a flush surface that is a surface cut together with the substrate and flush with the cut surface; the mold resin includes a thin portion having (i) a parallel surface that is a surface parallel to the first substrate face and (ii) the flush surface joined with the parallel surface, the thin portion of the mold resin being smaller in thickness than a sealing portion that is a portion of the mold resin sealing the electronic part, the sealing portion of the mold resin being positioned opposite the cut surface to cause the parallel surface to be interposed between (i) the sealing portion of the mold resin and (ii) the cut surface, the electronic device further comprising an alternately disposed portion disposing alternatively (i) a sealed region forming the thin portion of the mold resin and (ii) an exposed region not forming the thin portion, in a direction of a boundary line between the first substrate face of the substrate and the flush surface of the mold resin, wherein a plurality of the exposed regions of the alternately disposed portion are respectively provided with a plurality of first electrodes on the first substrate face, the first electrodes being mutually differing in potential. |
