| 发明名称 |
APPARATUS AND A METHOD FOR TREATING A SUBSTRATE |
| 摘要 |
A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid. |
| 申请公布号 |
US2016104629(A1) |
申请公布日期 |
2016.04.14 |
| 申请号 |
US201514972505 |
申请日期 |
2015.12.17 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM HONGJIN;KIM KYOUNGSEOB;SHIN SUNGHO;LEE KUNTACK;CHO KIHONG |
| 分类号 |
H01L21/306 |
主分类号 |
H01L21/306 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate treating method comprising:
jetting a fluid containing an abrasive onto a substrate; and polishing the substrate using the jetted fluid. |
| 地址 |
Suwon-si KR |
