发明名称 CMP POLISHING AGENT, METHOD FOR MANUFACTURING SAME, AND METHOD FOR POLISHING SUBSTRATE
摘要 The present invention is a CMP polishing agent that contains polishing particles, a protective agent, and water, wherein CMP polishing agent is characterized in that the protective agent is a silsesquioxane polymer having a polar group. Due to this configuration, provided is a CMP polishing agent which has high polishing selectivity and which can reduce polishing damage caused by polishing, in a CMP step.
申请公布号 WO2016056165(A1) 申请公布日期 2016.04.14
申请号 WO2015JP04360 申请日期 2015.08.28
申请人 SHIN-ETSU CHEMICAL CO.,LTD. 发明人 TAKAHASHI, MITSUHITO
分类号 C09K3/14;B24B37/00;C09G1/02;H01L21/304 主分类号 C09K3/14
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