发明名称 EPOXY RESIN COMPOSITION AND ELECTRONIC PART DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition indicating superior flowability, and an electric part device with an element sealed by the epoxy resin composition.SOLUTION: An epoxy resin composition contains (A) epoxy resin, (B) phenolic resin and (C) additive reactant of triisobutyl phosphine and quinone compound. An electric part device comprises an element sealed by the epoxy resin composition.SELECTED DRAWING: None
申请公布号 JP2016053187(A) 申请公布日期 2016.04.14
申请号 JP20160000198 申请日期 2016.01.04
申请人 HITACHI CHEMICAL CO LTD 发明人 NAKAMURA SHINYA
分类号 C08G59/68;H01L23/29;H01L23/31 主分类号 C08G59/68
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