发明名称 TRI-GATE DEVICES AND MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device comprising a semiconductor body having a top surface and sidewalls on both right and left sides formed on a substrate, and to provide a method for manufacturing the semiconductor device.SOLUTION: A gate dielectric layer 322 is formed on a top surface of a semiconductor body 308 and on sidewalls on both right and left sides of the semiconductor body 308. A gate electrode 324 is formed on a gate dielectric 322 on the top surface of the semiconductor body 308 and is formed adjacently to the gate dielectric 322 on the sidewalls on both the right and left sides of the semiconductor body 308.SELECTED DRAWING: Figure 3
申请公布号 JP2016054320(A) 申请公布日期 2016.04.14
申请号 JP20150239417 申请日期 2015.12.08
申请人 INTEL CORP 发明人 CHAU ROBERT;DOYLE BRIAN;KAVALIEROS JACK;BARLAGE DOUGLAS;DATTA SUMAN
分类号 H01L29/786;H01L21/336;H01L29/423 主分类号 H01L29/786
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