| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing unit capable of practicing sputter deposition accompanying sufficient rotation and cooling of a workpiece.SOLUTION: A processing unit includes a processing vessel 1 in which a target for sputtering is disposed, a rotatable placing stand 2 which is installed in the processing vessel 1 and on which a workpiece is placed, a cooling mechanism 5 for cooling the placing stand 2, and a drive mechanism 6 for changing the relative position of the placing stand to the cooling mechanism 5. The drive mechanism 6 can bring the placing stand 2 close to or away from the cooling mechanism 5, and thus can change a heat transfer rate from the placing stand 2 to the cooling mechanism 5.SELECTED DRAWING: Figure 2 |
