| 发明名称 |
On Board Transceiver |
| 摘要 |
An electrical component assembly includes a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate. In use the first electrical component generates a first amount of heat and the second component generates a second amount of heat. The first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path, such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path. |
| 申请公布号 |
US2016105241(A1) |
申请公布日期 |
2016.04.14 |
| 申请号 |
US201314893965 |
申请日期 |
2013.05.29 |
| 申请人 |
FCI ASIA PTE. LTD. |
发明人 |
KEIL Ulrich |
| 分类号 |
H04B10/40;H01S5/183;H01L31/16;H05K1/11;H05K1/18;H01S5/024;H05K1/02 |
主分类号 |
H04B10/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electrical component assembly comprising a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate,
wherein in use the first electrical component generates a first amount of heat and the second component generates a second amount of heat, wherein the first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path, such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path. |
| 地址 |
Singapore SG |
