| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide film having no deterioration of adhesiveness with other materials and wettability and enhanced slipperiness under high moisture during lamination or laminate with other materials and a polyamide resin composition as a raw material thereof.SOLUTION: There is provided a polyamide resin composition for manufacturing a polyamide film containing a polyamide resin (A), an inorganic filler (B) and a bisamide compound, where (A) consists of 60 to 98 pts.mass of a component a and 40 to 2 pts.mass of a component b, the component a is a polyamide resin having 23°C water saturation water absorption percentage of 8.0 mass% or more, a component b is a polyamide resin having flexure elastic modulus measured according to ASTM D-790 at 23°C and relative humidity (RH) of 50% of 3,000 MPa or more, (B) is manufactured by a surface treatment of inorganic filler particles with organosiloxane, (C) is manufactured by reacting aliphatic acid having 14 or more carbon atoms and diamine, the content of (B) is 0.01 to 0.4 pts.mass and that of (C) is 0.02 to 25 pts.mass based on 100 pts.mass of the (A) and coefficient of static friction measured according to ASTM D-1984 at 23°C and relative humidity (RH) of 90% is 1.0 or less.SELECTED DRAWING: None |
