| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bond sensor package reduced in height of a package, and a method.SOLUTION: A packaged chip assembly 56 includes: a semiconductor substrate 20; a semiconductor device 42 integrally formed on or in the top surface of the substrate; and first bonding pads 24 at the top surface of the substrate, which are electrically coupled to the semiconductor device. A second substrate 32 includes: a first aperture 28 and one or more second apertures 30 extending therethrough; second and third bonding pads at the top surface and the bottom surface of the second substrate, respectively; and conductors electrically coupled to the second and third bonding pads. The top surface of the semiconductor substrate is secured to the bottom surface of the second substrate such that the semiconductor device is aligned with the first aperture 28, and each of the first bonding pads is aligned with one of the second apertures 30.SELECTED DRAWING: Figure 3A |
