| 摘要 |
PROBLEM TO BE SOLVED: To provide a phase change type cooling module which enables simplification of a structure in an electronic device, and to provide a cooling module mounting substrate and the electronic device.SOLUTION: A cooling module includes: a housing configured to house a heating element and a refrigerant in which the heating element is immersed; and a liquid passage located at an upper part of the housing and in which a cooling liquid for condensing steam of the refrigerant is circulated.SELECTED DRAWING: Figure 4 |
