| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder alloy for terminals having improved breakage resistance when pulling up a terminal part from melting solder.SOLUTION: A lead-free solder alloy for terminals comprises Cu of 4 mass% or more and 6 mass% or less, Ni of 0.1 mass% or more and 0.2 mass% or less, Ga of 0.01 mass% or more and 0.04 mass% or less, P of 0.004 mass% or more and 0.03 mass% or less, Ga and P in total of 0.05 mass% or less, with the balance being Sn.SELECTED DRAWING: None |
