LIGHT EMITTING DEVICE PACKAGE

摘要

A light emitting device package is provided. The light emitting device package includes a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

主权项

1. A semiconductor light emitting device package, comprising:
a package body; a first cavity and a second cavity underneath the first cavity on the package body; a first lead electrode on the second cavity; a second lead electrode spaced apart from the first lead electrode; and a light emitting device on the first lead electrode, wherein a bottom of the second cavity comprises an opening through the package body, wherein the first lead electrode comprises a bottom portion exposed through the opening, and wherein a bottom surface of the first lead electrode exposed through the opening is substantially flush with a bottom surface of the second cavity.