THERMOSETTING RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR

摘要

[Problem] To obtain a thermosetting resin composition with which the occurrence of voids, when treated under the increasing temperature conditions required for underfilling in a semiconductor chip thermal compression bonding step using a thermal compression bonding construction method, is limited and which is capable of being used as underfill for obtaining good solder connections. [Solution] A thermosetting resin composition comprising a thermosetting resin, a curing agent and a flux agent. For the resin composition, the temperature at which the viscosity temperature change rate reaches 30 Pa∙sec/°C when temperature is increased with a prescribed temperature increase profile is 200-250°C.