| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor device capable of sufficiently preventing protrusion of resin from the boundary of the side face toward an exposed part. <P>SOLUTION: The manufacturing method of a semiconductor device includes a molding step for sealing a metal plate 4 including an exposed part 4a with resin excepting the exposed part by using dies 2, 3 having a pressing direction F, and a deformation step for forming a recess 4b by deforming the boundary 4L of the exposed part 4a and other part on the side face 4aa that is parallel with the pressing direction F of the metal plate 4 with a resin stop member 5. The deformation step and the molding step are carried out simultaneously. <P>COPYRIGHT: (C)2013,JPO&INPIT |
