发明名称 SURFACE MOUNT HEADER ASSEMBLY HAVING A PLANAR ALIGNMENT SURFACE
摘要 A header assembly includes an insulative housing having a plurality of walls defining an interior cavity extending along a mating axis, and a plurality of contacts within the cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulative housing includes at least one alignment rib extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts are formed against and abutting the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.
申请公布号 EP1851826(B1) 申请公布日期 2016.04.13
申请号 EP20060736322 申请日期 2006.02.24
申请人 TYCO ELECTRONICS CORPORATION 发明人 MYER, JOHN, MARK;CAMPBELL, CRAIG, MAURICE;MALSTROM, CHARLES, RANDALL;FRY, DANIEL, WILLIAMS, JR.;MOLL, HURLEY, CHESTER
分类号 H01R12/57;H01R12/71;H01R43/02 主分类号 H01R12/57
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