发明名称 Method of printing conductive metal circuit diagram on circuit substrate by lithography and printed product thereof
摘要 A method of printing a conductive metal circuit diagram on a circuit substrate (40) by lithography and a printed product thereof, characterized in that a multi-color automatic printing machine (10) and a plurality of printing stencils (32, 34, 36) are provided for printing a desired product, wherein a first printing ink holder (11) of the multi-color automatic printing machine is filled with an adhesive, and a second printing ink holder (12) is modified into a cooling bronzing device and installed with a roller type conductive metal foil material, and then each printing ink holder (13-15) is filled with different color printing inks according to printing requirements, and the adhesive ink holder (11) and a stencil holder (111-151) of each coloring ink holder is equipped with a corresponding printing stencil, and each printing stencil is etched with a pattern desired for printing a circuit, a mark, a symbol, or a text, and after the circuit substrate (40) is conveyed according to an automatic conveying route of the multi-color automatic printing machine, a conductive metal circuit diagram (42) and related printing and coloring processes are completed quickly.
申请公布号 EP3007525(A1) 申请公布日期 2016.04.13
申请号 EP20140187876 申请日期 2014.10.07
申请人 BAI SHA TECHNOLOGY CORP. 发明人 LIN, YEN-SHU
分类号 H05K3/00;H05K3/12 主分类号 H05K3/00
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