SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, ELECTRONIC DEVICE AND ELECTRONIC COMPONENT

摘要

[Object] To improve connection reliability between a wiring board and a semiconductor component in a semiconductor device, a method for manufacturing the same, an electronic device, and an electronic component. [Solving Means] A semiconductor device includes: a wiring board 11 including a first electrode pad 14 on a surface thereof; a circuit board 30 disposed to stand on the wiring board 11, and including an interconnection 31 connected to the first electrode pad 14; and a semiconductor package 20 disposed to face the wiring board 11 with the circuit board 30 interposed therebetween, and including a second electrode pad 19 on a surface thereof, the second electrode pad 19 being connected to the interconnection 31.