发明名称 シールド付フレキシブルプリント配線板、その製造方法、および電子機器
摘要 <P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board of simple structure having a shield, in which the cross sectional area of a signal line can be ensured even when impedance matching is performed while attaining a high shield performance. <P>SOLUTION: A reinforcement insulation layer 4 is located in contact with a cover insulation layer 2, and a shield layer 5 covers the reinforcement insulation layer. The reinforcement insulation layer 4 is located in a region smaller than the cover insulation layer geometrically (1), includes a punched part morphologically (2), and is porous in material (3). Average density of the reinforcement insulation layer in a region where the signal line is located in the plan view is higher than or equal to that in a region where the signal line is not located. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5904354(B2) 申请公布日期 2016.04.13
申请号 JP20110152009 申请日期 2011.07.08
申请人 住友電工プリントサーキット株式会社 发明人 安達 芳朗;生岩 寛史;森實 勝也
分类号 H05K1/02;H05K9/00 主分类号 H05K1/02
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