发明名称 |
INTEGRATING MULTI-OUTPUT POWER CONVERTERS HAVING VERTICALLY STACKED SEMICONDUCTOR CHIPS |
摘要 |
A packaged multi-output converter (200) comprising a leadframe with a chip pad (201) as ground terminal and a plurality of leads (202) including the electrical input terminal (203); a first FET chip (sync chip, 220) with its source terminal affixed to the leadframe and on its opposite surface a first drain terminal (221) positioned adjacent to a second drain terminal (222), the drain terminals connected respectively by a first (241) and a second (242) metal clip to a first (204) and second (205) output lead; a second FET chip (control chip, 211), positioned vertically over the first drain terminal, with its source terminal attached onto the first clip; a third FET chip (control chip, 212), positioned vertically over the second drain terminal, with its source terminal attached onto the second clip; and the drain terminals (213, 214) of the second and third chips attached onto a third metal clip (260) connected to the input lead (203). |
申请公布号 |
EP3005417(A1) |
申请公布日期 |
2016.04.13 |
申请号 |
EP20140782292 |
申请日期 |
2014.04.11 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
DENISON, MARIE;CARPENTER, BRIAN, ASHLEY;LOPEZ, OSVALDO, JORGE;HERBSOMMER, JUAN, ALEJANDRO;NOQUIL, JONATHAN |
分类号 |
H01L27/02;H05K1/02 |
主分类号 |
H01L27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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