| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, a solid-state imaging apparatus, and a camera system that can reduce influence of noise due to a connection portion between both chips, requires no special circuit for communication, and can consequently reduce a cost.SOLUTION: The semiconductor device, the solid-state imaging apparatus, and the camera system each includes a first chip 11 and a second chip 12, and each has a lamination structure with the first chip 11 and the second chip 12 stuck to each other. The first chip 11 is mounted with a high withstand voltage transistor-based circuit, and the second chip 12 is mounted with a low withstand voltage transistor-based circuit having withstand voltage lower than that of the high withstand voltage transistor-based circuit. Wiring between the first chip and the second chip is connected through a via formed in the first chip. |
