发明名称 |
METHOD FOR PRODUCING A PRINTED CIRCUIT, PRINTED CIRCUIT OBTAINED BY THIS METHOD AND ELECTRONIC MODULE COMPRISING SUCH A PRINTED CIRCUIT |
摘要 |
The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit. |
申请公布号 |
EP3005846(A1) |
申请公布日期 |
2016.04.13 |
申请号 |
EP20140726394 |
申请日期 |
2014.05.27 |
申请人 |
LINXENS HOLDING |
发明人 |
DIEU-GOMONT, SÉVERINE;HOVEMAN, BERTRAND |
分类号 |
H05K1/11;G06K19/077;H01L23/00;H01L23/498;H05K3/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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