| 摘要 |
The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, the method comprising the following steps: a) providing a first system having ligands and amine functional groups, said first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X—(NH2)n, where X belongs to the group constituted by (CH3, CH3—CH2, CH3—(CH2)m), or NH3 or an xp−(NH4)+p salt where x is an acid radical belonging to the group constituted by (PO43−, HPO42−, H2PO4−, HPO42−and H2PO4−, SO42−, HSO4−, H2SO4, HSO4−, and H2SO4, CH3COO−, CH3COOH, and CH3COO−), or H2SO4, or CH3COOH, and where n, m, and p are non-zero integers; b) providing a second system forming a buffer system; c) providing a third system providing a metallic salt, and constituted by an aqueous solution of platinum; d) providing a fourth system suitable for imparting the conduction property to the medium; and e) mixing together the four systems so as to obtain the said electrolyte bath. The method is applicable to plating a metallic underlayer as a thermal barrier on a part made of superalloy. |
