| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of improving productivity of a wiring board.SOLUTION: A method of manufacturing a wiring board comprises: forming a substrate (24) having wiring (22); subsequently forming a thermosetting resin layer (25) on the substrate (24); subsequently forming a metal mask (36) having an opening (35) on the thermosetting resin layer (25); subsequently chemically removing the thermosetting resin layer (25) exposed from the opening (35) to form an opening (41) for exposing the substrate (24) in the thermosetting resin layer (25); and subsequently removing the metal mask (36).SELECTED DRAWING: Figure 10 |
