| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin material for injection molding, which has excellent thermal conductivity, moldability and heat resistance while maintaining excellent electric characteristics of an epoxy resin, and gives a molded product having excellent crack resistance. <P>SOLUTION: The epoxy resin material for injection molding comprises an epoxy resin composition which contains a multifunctional epoxy resin (A), a bifunctional epoxy resin (B), an epoxy type resin curing agent (C), a curing accelerator (D), an inorganic filler (E), a silane coupling agent (F) and a releasing agent (G), and is solid at ordinary temperature. The cured product of the material has a thermal conductivity of at least 1.5 W×m/K, a glass transition temperature of at least 140°C and at most 200°C, a linear expansion rate of at most 40 ppm at below or equal to the glass transition temperature, and an elastic modulus of less than 20 GPa and at least 10 GPa at below or equal to the glass transition temperature. <P>COPYRIGHT: (C)2013,JPO&INPIT |
