发明名称 METHOD OF FORMING CONDUCTIVE PATTERN THROUGH DIRECT IRRADIATION OF ELECTROMAGNETIC WAVES AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN
摘要 Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, and appropriately implementing the polymer resin products having white color or various colors, and the like, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed therefrom. The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing titanium dioxide (TiO 2 ); forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.
申请公布号 EP3007182(A1) 申请公布日期 2016.04.13
申请号 EP20140833847 申请日期 2014.08.07
申请人 LG CHEM, LTD. 发明人 KIM, JAE HYUN;JUN, SHIN HEE;KIM, JAE JIN;PARK, CHEE-SUNG;SEONG, EUN KYU;LEE, SU JEONG;PARK, CHEOL-HEE;JEONG, HAN NAH;JUNG, SANG YUN
分类号 H01B13/00;C08J7/04;C23C18/16;C23C18/20;C23C18/22;C23C18/30;C25D5/02;C25D5/56;H01B5/14;H05K3/02;H05K3/18 主分类号 H01B13/00
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