发明名称 |
METHOD OF FORMING CONDUCTIVE PATTERN THROUGH DIRECT IRRADIATION OF ELECTROMAGNETIC WAVES AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN |
摘要 |
Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, and appropriately implementing the polymer resin products having white color or various colors, and the like, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed therefrom. The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing titanium dioxide (TiO 2 ); forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region. |
申请公布号 |
EP3007182(A1) |
申请公布日期 |
2016.04.13 |
申请号 |
EP20140833847 |
申请日期 |
2014.08.07 |
申请人 |
LG CHEM, LTD. |
发明人 |
KIM, JAE HYUN;JUN, SHIN HEE;KIM, JAE JIN;PARK, CHEE-SUNG;SEONG, EUN KYU;LEE, SU JEONG;PARK, CHEOL-HEE;JEONG, HAN NAH;JUNG, SANG YUN |
分类号 |
H01B13/00;C08J7/04;C23C18/16;C23C18/20;C23C18/22;C23C18/30;C25D5/02;C25D5/56;H01B5/14;H05K3/02;H05K3/18 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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