| 摘要 |
The object of the present invention is to provide a multi-layer wiring board which is easy to adjust the characteristic impedance and is able to adapt to the narrow-pitch tendency of terminals, and a process for manufacturing the same. The present invention attain the object by providing a multi-layer wiring board, in which more than one wiring layers are stacked on a substrate with an insulating layer between them, wherein a wire formed in the wiring layer has a double layered structure consists of a first layer and a second layer, and said first layer is made of a first conductive material and said second layer is made of a second conductive material having relative magnetic permeability larger than that of the first conductive material, thereby the characteristic impedance of said wire is adjusted to a value closer to 50 ohm than that of a wire which has the same thickness as of said wire having the double layered structure, and is made of said first conductive material only, and a process for manufacturing the same. |
