| 摘要 |
Provided is a method for producing a plated component, which is capable of forming a plating film only in a predetermined pattern, while suppressing the formation of a plating film in places other than the predetermined pattern by simple production processes. A method for producing a plated component, which comprises: having a catalyst deactivator applied to the surface of a base; having a part of the base surface, to which the catalyst deactivator has been applied, subjected to heating or light irradiation; having the base surface hold an electroless plating catalyst; and bringing an electroless plating liquid into contact with the base surface, which holds the electroless plating catalyst, thereby forming an electroless plating film on the heated part or light irradiated part of the surface. |
